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? 2003 microchip technology inc. ds21733d-page 1 m mcp6001/2/4 features ? available in sc-70-5 and sot-23-5 packages ? 1 mhz gain bandwidth product (typ.) ? rail-to-rail input/output ? supply voltage: 1.8v to 5.5v ? supply current: i q = 100 a (typ.) ? 90 phase margin (typ.) ? temperature range: - industrial: -40c to +85c - extended: -40c to +125c ? available in single, dual and quad packages applications ? automotive ? portable equipment ? photodiode pre-amps ? analog filters ? notebooks and pdas ? battery-powered systems available tools spice macro models (at www.microchip.com) filterlab ? software (at www.microchip.com) typical application description the microchip technology inc. mcp6001/2/4 family of operational amplifiers (op amps) is specifically designed for general-purpose applications. this family has a 1 mhz gain bandwidth product and 90 phase margin (typ.). it also maintains 45 phase margin (typ.) with 500 pf capacitive load. this family operates from a single supply voltage as low as 1.8v, while drawing 100 a (typ.) quiescent current. additionally, the mcp6001/2/4 supports rail-to-rail input and output swing, with a common mode input voltage range of v dd + 300 mv to v ss - 300 mv. this family of opera- tional amplifiers is designed with microchip?s advanced cmos process. the mcp6001/2/4 family is available in the industrial and extended temperature ranges. it also has a power supply range of 1.8v to 5.5v. package types r 1 v out r 2 v in v dd + - gain 1 r 1 r 2 ----- - + = non-inverting amplifier mcp6001 v ref v ss 4 mcp6001 1 2 3 - + 5 v dd v in ? v out v ss v in + sc-70-5, sot-23-5 mcp6002 pdip, soic, msop mcp6004 v ina + v ina ? v ss 1 2 3 4 14 13 12 11 - v outa + - + a d v dd v outd v ind ? v ind + 10 9 8 5 6 7 v outb v inb ? v inb +v inc + v inc ? v outc + - bc - + pdip, soic, tssop v ina + v ina ? v ss 1 2 3 4 8 7 6 5 - v outa + - + a b v dd v outb v inb ? v inb + 4 1 2 3 - + 5 v dd v out v ss mcp6001r sot-23-5 4 1 2 3 - + 5 v ss v in ? v out v dd v in + mcp6001u sot-23-5 4 1 2 3 - + 5 v dd v out v in + v ss v in ? 1 mhz bandwidth low power op amp
mcp6001/2/4 ds21733d-page 2 ? 2003 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd - v ss .........................................................................7.0v all inputs and outputs ...................... v ss -0.3v to v dd +0.3v difference input voltage ....................................... |v dd - v ss | output short circuit current ..................................continuous current at input pins ....................................................2 ma current at output and supply pins ............................30 ma storage temperature ....................................-65c to +150c maximum junction temperature (t j ) .......................... +150c esd protection on all pins (hbm;mm) ............... 4 kv; 200v ? notice: stresses above those listed under ?maximum rat- ings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. expo- sure to maximum rating conditions for extended periods may affect device reliability. pin function table dc electrical specifications name function v in +, v ina +, v inb +, v inc +, v ind + non-inverting inputs v in ?, v ina ?, v inb ?, v inc ?, v ind ? inverting inputs v dd positive power supply v ss negative power supply v out , v outa , v outb , v outc , v outd outputs electrical characteristics : unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, r l = 10 k ? to v dd /2, and v out ~v dd /2. parameters sym min typ max units conditions input offset input offset voltage v os -7.0 ? +7.0 mv v cm = v ss input offset drift with temperature ? v os / ? t a ?2.0?v/ct a = -40c to +125c, v cm = v ss power supply rejection psrr ? 86 ? db v cm = v ss input bias current and impedance input bias current: i b ?1.0?pa industrial temperature i b ?19?pat a = +85c extended temperature i b ?1100? pat a = +125c input offset current i os ?1.0?pa common mode input impedance z cm ?10 13 ||6 ? ? ||pf differential input impedance z diff ?10 13 ||3 ? ? ||pf common mode common mode input range v cmr v ss ? 0.3 ? v dd + 0.3 v common mode rejection ratio cmrr 60 76 ? db v cm = -0.3v to 5.3v, v dd = 5v open-loop gain dc open-loop gain (large signal) a ol 88 112 ? db v out = 0.3v to v dd - 0.3v, v cm =v ss output maximum output voltage swing v ol , v oh v ss + 25 ? v dd ? 25 mv v dd = 5.5v output short-circuit current i sc ?6?mav dd = 1.8v ?23?mav dd = 5.5v power supply supply voltage v dd 1.8 ? 5.5 v quiescent current per amplifier i q 50 100 170 a i o = 0, v dd = 5.5v, v cm = 5v
? 2003 microchip technology inc. ds21733d-page 3 mcp6001/2/4 ac electrical specifications temperature specifications electrical characteristics: unless otherwise indicated, t a = +25c, v dd = +1.8 to 5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2, and c l = 60 pf. parameters sym min typ max units conditions ac response gain bandwidth product gbwp ? 1.0 ? mhz phase margin pm ? 90 ? g = +1 slew rate sr ? 0.6 ? v/s noise input noise voltage e ni ? 6.1 ? vp-p f = 0.1 hz to 10 hz input noise voltage density e ni ?28?nv/ hz f = 1 khz input noise current density i ni ?0.6?fa/ hz f = 1 khz electrical characteristics: unless otherwise indicated, v dd = +1.8v to +5.5v, and v ss = gnd. parameters sym min typ max units conditions temperature ranges industrial temperature range t a -40 ? +85 c extended temperature range t a -40 ? +125 c operating temperature range t a -40 ? +125 c (note) storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5l-sc70 ja ? 331 ? c/w thermal resistance, 5l-sot-23 ja ? 256 ? c/w thermal resistance, 8l-pdip ja ?85?c/w thermal resistance, 8l-soic (150 mil) ja ? 163 ? c/w thermal resistance, 8l-soic (208 mil) ja ?118?c/w thermal resistance, 8l-msop ja ? 206 ? c/w thermal resistance, 14l-pdip ja ? 70 ? c/w thermal resistance, 14l-soic ja ? 120 ? c/w thermal resistance, 14l-tssop ja ? 100 ? c/w note: the industrial temperature devices operate over this extended temperature range, but with reduced perfor- mance. in any case, the internal junction temperature (t j ) must not exceed the absolute maximum specification of +150c.
mcp6001/2/4 ds21733d-page 4 ? 2003 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2, and c l = 60 pf. figure 2-1: input offset voltage histogram. figure 2-2: psrr, cmrr vs. frequency. figure 2-3: input bias current at +85c histogram. figure 2-4: cmrr, psrr vs. ambient temperature. figure 2-5: open-loop gain, phase vs. frequency. figure 2-6: input bias current at +125c histogram. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% 20% 22% -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 input offset voltage (mv) percentage of occurrences 1225 samples v cm = v ss 20 30 40 50 60 70 80 90 100 1 .e+01 1 .e+02 1 .e+03 1 .e+04 1 .e+05 frequency (hz) psrr, cmrr (db) psrr+ cmrr psrr- v cm = v ss 10 100 1k 10k 100k 0% 2% 4% 6% 8% 10% 12% 14% 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 input bias current (pa) percentage of occurrences 1230 samples v dd = 5.5 v v cm = v dd t a = +85c 70 80 90 100 -50 -25 0 25 50 75 100 125 ambient temperature (c) psrr, cmrr (db) psrr (v cm = v ss ) cmrr (v cm = -0.3v to +5.3v) -20 0 20 40 60 80 100 120 1 .e- 01 1 .e+00 1 .e+01 1 .e+02 1 .e+03 1 .e+04 1 .e+05 1 .e+06 1 .e+07 frequency (hz) open loop gain (db) -210 -180 -150 -120 -90 -60 -30 0 open loop phase () 0.1 1 10 100 10k 100k 1m 10m phase gain 1k v cm = v ss 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% 55% 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 input bias current (pa) percentage of occurrences 605 samples v dd = 5.5 v v cm = v dd t a = +125c
? 2003 microchip technology inc. ds21733d-page 5 mcp6001/2/4 note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2, and c l = 60 pf. figure 2-7: input noise voltage density vs. frequency. figure 2-8: input offset voltage vs. common mode input voltage at v dd = 1.8v. figure 2-9: input offset voltage vs. common mode input voltage at v dd = 5.5v. figure 2-10: input offset voltage drift histogram. figure 2-11: input offset voltage vs. output voltage. figure 2-12: output short-circuit current vs. ambient temperature. 10 100 1,000 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency (hz) input noise voltage density (nv/ ? hz) e ni = 6.1 v p-p , f = 0.1 to 10 hz 0.1 10 1 100 10k 1k 100k -700 -600 -500 -400 -300 -200 -100 0 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 common mode input voltage (v) input offset voltage (v) v dd = 1.8v t a = -40c t a = +25c t a = +85c t a = +125c -700 -600 -500 -400 -300 -200 -100 0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 common mode input voltage (v) input offset voltage (v) v dd = 5.5v t a = -40c t a = +25c t a = +85c t a = +125c 0% 2% 4% 6% 8% 10% 12% 14% 16% 18% -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 input offset voltage drift (v/c) percentage of occurrences 1225 samples v cm = v ss t a = -40c to +125c -200 -150 -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 output voltage (v) input offset voltage (v) v dd = 1.8v v cm = v ss v dd = 5.5v 0 5 10 15 20 25 30 35 -50 -25 0 25 50 75 100 125 ambient temperature (c) output short circuit current (ma) -i sc , v dd = 1.8v +i sc , v dd = 1.8v +i sc , v dd = 5.5v -i sc , v dd = 5.5v
mcp6001/2/4 ds21733d-page 6 ? 2003 microchip technology inc. note: unless otherwise indicated, t a = +25c, v dd = +1.8v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, r l = 10 k ? to v dd /2, and c l = 60 pf. figure 2-13: slew rate vs. ambient temperature. figure 2-14: output voltage headroom vs. output current magnitude. figure 2-15: output voltage swing vs. frequency. figure 2-16: small signal non-inverting pulse response. figure 2-17: large signal non-inverting pulse response. figure 2-18: quiescent current vs. power supply voltage. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50-250 255075100125 ambient temperature (c) slew rate (v/s) falling edge, v dd = 5.5v rising edge, v dd = 5.5v rising edge, v dd = 1.8v falling edge, v dd = 1.8v 1 10 100 1,000 1.e-05 1.e-04 1.e-03 1.e-02 output current magnitude (a) output voltage headroom (mv) v dd - v oh 10 10m 1m 100 v ol - v ss 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 frequency (hz) output voltage swing (v p-p ) v dd = 5.5v 1k 10k 100k 1m v dd = 1.8v -0.08 -0.06 -0.04 -0.02 0.00 0.02 0.04 0.06 0.08 0 .e+00 1 .e- 06 2 .e- 06 3 .e- 06 4 .e- 06 5 .e- 06 6 .e- 06 7 .e- 06 8 .e- 06 9 .e- 06 1 .e- 05 time (1 s/div) output voltage (20 mv/div) g = +1 v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.e+00 1.e-05 2.e-05 3.e-05 4.e-05 5.e-05 6.e-05 7.e-05 8.e-05 9.e-05 1.e-04 time (10 s/div) output voltage (v) g = +1 v/v v dd = 5.0v 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) quiescent current per amplifier (ma) t a = 85c t a = 25c t a = -40c v cm = v dd - 0.5v t a = +125c
? 2003 microchip technology inc. ds21733d-page 7 mcp6001/2/4 3.0 application information the mcp6001/2/4 family of op amps is manufactured using microchip?s state-of-the-art cmos process and is specifically designed for low cost, low power and general-purpose applications. the low supply voltage, low quiescent current and wide bandwidth makes the mcp6001/2/4 ideal for battery-powered applications. this device has high phase margin, which makes it stable for larger capacitive load applications. 3.1 rail-to-rail input the mcp6001/2/4 op amp is designed to prevent phase reversal when the input pins exceed the supply voltages. figure 3-1 shows the input voltage exceeding the supply voltage without any phase reversal. figure 3-1: the mcp6001/2/4 shows no phase reversal. the input stage of the mcp6001/2/4 op amp uses two differential input stages in parallel; one operates at low common mode input voltage (v cm ) and the other at high v cm . with this topology, the device operates with v cm up to 300 mv above v dd and 300 mv below v ss . the input offset voltage is measured at v cm =v ss - 300 mv and v dd + 300 mv to ensure proper operation. input voltages that exceed the input voltage range (v ss - 0.3v to v dd + 0.3v at 25c) can cause exces- sive current to flow into or out of the input pins. current beyond 2 ma can cause reliability problems. applica- tions that exceed this rating must be externally limited with a resistor, as shown in figure 3-2. figure 3-2: input current limiting resistor (r in ). 3.2 rail-to-rail output the output voltage range of the mcp6001/2/4 op amp is v dd - 25 mv (min.) and v ss + 25 mv (max.) when r l =10k ? is connected to v dd /2 and v dd = 5.5v. refer to figure 2-14 for more information. 3.3 capacitive loads driving large capacitive loads can cause stability prob- lems for voltage feedback op amps. as the load capac- itance increases, the feedback loop?s phase margin decreases, and the closed loop bandwidth is reduced. this produces gain peaking in the frequency response, with overshoot and ringing in the step response. a unity gain buffer (g = +1) is the most sensitive to capacitive loads, but all gains show the same general behavior. when driving large capacitive loads with these op amps (e.g., > 100 pf when g = +1), a small series resistor at the output (r iso in figure 3-3) improves the feedback loop?s phase margin (stability) by making the output load resistive at higher frequencies. it does not, however, improve the bandwidth. figure 3-3: output resistor, r iso stabilizes large capacitive loads. to select r iso , check the frequency response peaking (or step response overshoot) on the bench (or with the mcp6001/2/4 spice macro model). if the response is reasonable, you do not need r iso . otherwise, start r iso at 1 k ? and modify its value until the response is reasonable. -1 0 1 2 3 4 5 6 0 .e+00 1 .e- 05 2 .e- 05 3 .e- 05 4 .e- 05 5 .e- 05 6 .e- 05 7 .e- 05 8 .e- 05 9 .e- 05 1 .e- 04 time (10 s/div) input, output voltages (v) v dd = 5.0v g = +2 v/v v in v out r in v ss minimum expected v in () ? 2 ma --------------------------------------------------------------------------- - r in maximum expected v in () v dd ? 2 ma ------------------------------------------------------------------------------ - v in r in v out mcp600x ? + v in r iso v out mcp600x c l ? +
mcp6001/2/4 ds21733d-page 8 ? 2003 microchip technology inc. 3.4 supply bypass with this family of operation amplifiers, the power sup- ply pin (v dd for single supply) should have a local bypass capacitor (i.e., 0.01 f to 0.1 f) within 2 mm for good high frequency performance. it also needs a bulk capacitor (i.e., 1 f or larger) within 100 mm to provide large, slow currents. this bulk capacitor can be shared with other parts. 3.5 pcb surface leakage in applications where low input bias current is critical, pcb (printed circuit board) surface leakage effects need to be considered. surface leakage is caused by humidity, dust or other contamination on the board. under low humidity conditions, a typical resistance between nearby traces is 10 12 ? . a 5v difference would cause 5 pa, if current-to-flow; this is greater than the mcp6001/2/4 family?s bias current at 25c (1 pa, typ). the easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). the guard ring is biased at the same voltage as the sensitive pin. an example of this type of layout is shown in figure 3-4. figure 3-4: example guard ring layout for inverting gain. 1. non-inverting gain and unity gain buffer: a. connect the non-inverting pin (v in +) to the input with a wire that does not touch the pcb surface. b. connect the guard ring to the inverting input pin (v in ?). this biases the guard ring to the common mode input voltage. 2. inverting and transimpedance gain amplifiers (convert current to voltage, such as photo detec- tors): a. connect the guard ring to the non-inverting input pin (v in +). this biases the guard ring to the same reference voltage as the op amp (e.g., v dd /2 or ground). b. connect the inverting pin (v in ?) to the input with a wire that does not touch the pcb surface. 3.6 application circuits 3.6.1 unity gain buffer the rail-to-rail input and output capability of the mcp6001/2/4 op amp is ideal for unity-gain buffer applications. the low quiescent current and wide band- width makes the device suitable for a buffer configura- tion in an instrumentation amplifier circuit, as shown in figure 3-5. figure 3-5: instrumentation amplifier with unity gain buffer inputs. 3.6.2 active low-pass filter the mcp6001/2/4 op amp?s low input bias current makes it possible for the designer to use larger resis- tors and smaller capacitors for active low-pass filter applications. however, as the resistance increases, the noise generated also increases. parasitic capacitances and the large value resistors could also modify the fre- quency response. these trade-offs need to be considered when selecting circuit elements. it is possible to have a filter cutoff frequency as high as 1/10th of the op amp bandwidth (100 khz). figure 3-6 shows a second-order butterworth filter with 100 khz cutoff frequency and a gain of +1v/v. the component values were selected using microchip?s filterlab ? software. figure 3-6: active second-order low- pass filter. guard ring v ss v in -v in + v in1 r 2 mcp6002 v in2 r 2 mcp6002 v ref mcp6001 v out r 1 r 1 - + - + - + 1/2 1/2 v out v in2 v in1 ? () r 1 r 2 ----- - ? v ref + = r 1 = 20 k ? r 2 = 10 k ? 14.3 k ? mcp6002 v out 53.6 k ? 100 pf v in 33 pf + -
? 2003 microchip technology inc. ds21733d-page 9 mcp6001/2/4 3.6.3 peak detector the mcp6001/2/4 op amp has a high input impedance, rail-to-rail input and output and low input bias current, which makes this device suitable for a peak detector applications. figure 3-7 shows a peak detector circuit with clear and sample switches. the peak-detection cycle uses a clock (clk), as shown in figure 3-7. at the rising edge of clk, sample switch closes to begin sampling. the peak voltage stored on c 1 is sam- pled to c 2 for a sample time defined by t samp . at t he end of the sample time (falling edge of sample signal), clear signal goes high and closes the clear switch. when the clear switch closes, c 1 discharges through r 1 for a time defined by t clear . at the end of the clear time (falling edge of clear signal), op amp a begins to store the peak value of v in on c 1 for a time defined by t detect . in order to define the t samp and t clear , it is necessary to determine the capacitor charging and discharging period. the capacitor charging time is limited by the amplifier source current, while the discharging time ( ) is defined using r 1 ( = r 1 *c 1 ). t detect is the time that the input signal is sampled on c 1 , and is dependent on the input voltage change frequency. the op amp output current limit, and the size of the storage capacitors (both c 1 and c 2 ), could create slew- ing limitations as the input voltage (v in ) increases. cur- rent through a capacitor is dependent on the size of the capacitor and the rate of voltage change. from this relationship, the rate of voltage change or the slew rate can be determined. for example, with op amp short-cir- cuit current of i sc = 25 ma and load capacitor of c 1 = 0.1 f, then: equation this voltage change rate is less than the mcp6001/2/4 slew rate of 600 mv/s. when the input voltage swings below the voltage across c 1 , d 1 becomes reverse- biased, which opens the feedback loop and rails the amplifier. when the input voltage increases, the ampli- fier recovers at its slew rate. based on the rate of volt- age change shown in the above equation, it takes an extended period of time to charge a 0.1 f capacitor. the capacitors need to be selected so that the circuit is not limited by the amplifier slew rate. therefore, the capacitors should be less than 40 f and a stabilizing resistor (r iso ) needs to be properly selected. refer to section 3.3, ?capacitive load and stability?, for op amp stability. figure 3-7: peak detector with clear and sample cmos analog switches. dv c1 dt ------------ - i sc c 1 ------- - = 25ma 0.1 f -------------- - = dv c1 dt ------------ - 250mv s ----------------- = i sc c 1 dv c1 dt ------------ - = v in mcp6002 v c1 mcp6002 d 1 a b v out mcp6001 c c 2 sample signal clear signal clear r iso sample ? + ? + ? + clk t samp t clear t detect switch switch 1/2 1/2 r 1 r iso v c2 c 1
mcp6001/2/4 ds21733d-page 10 ? 2003 microchip technology inc. 4.0 design tools microchip provides the basic design tools needed for the mcp6001/2/4 family of op amps. 4.1 spice macro model the latest spice macro model for the mcp6001/2/4 operational amplifiers (op amps) is available on our website at www.microchip.com. this model is intended as an initial design tool that works well in the op amp?s linear region of operation at room temperature. see the model file for information on its capabilities. bench testing is a very important part of any design and cannot be replaced with simulations. also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 4.2 filterlab ? software filterlab is an innovative software tool that simplifies analog active filter (using op amps) design. available at no cost from our website at www.microchip.com, the filterlab software active filter software design tool pro- vides full schematic diagrams of the filter circuit with component values. it also outputs the filter circuit in spice format, which can be used with the macro model to simulate actual filter performance.
? 2003 microchip technology inc. ds21733d-page 11 mcp6001/2/4 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. mcp6002 i/p057 0307 mcp6002 i/sn0307 057 5-lead sc-70 ( mcp6001 ) example: 1 23 5 4 5-lead sot-23 ( mcp6001 ) example:( mcp6001 i-temp pinout) xxnn 1 23 5 4 aa07 xnn yww a57 307 8-lead msop example: xxxxxx ywwnnn 6002 307057 device industrial temp code extended temp code mcp6001 aann cdnn mcp6001r adnn cenn mcp6001u afnn cfnn note: applies to 5-lead sot-23.
mcp6001/2/4 ds21733d-page 12 ? 2003 microchip technology inc. package marking information (continued) 14-lead pdip (300 mil) ( mcp6004 )example: 14-lead tssop ( mcp6004 ) example: 14-lead soic (150 mil) ( mcp6004 ) example: xxxxxxxxxxxxxx xxxxxxxxxxxxxx yywwnnn xxxxxxxxxx yywwnnn xxxxxx yyww nnn mcp6004 -i/p 0307057 6004 st 0307 057 xxxxxxxxxx mcp6004 isl 0307057
? 2003 microchip technology inc. ds21733d-page 13 mcp6001/2/4 5-lead plastic package (sc-70) 0.30 0.15 .012 .006 b lead width 0.18 0.10 .007 .004 c lead thickness 0.30 0.10 .012 .004 l foot length 2.20 1.80 .087 .071 d overall length 1.35 1.15 .053 .045 e1 molded package width 2.40 1.80 .094 .071 e overall width 0.10 0.00 .004 .000 a1 standoff 1.00 0.80 .039 .031 a2 molded package thickness 1.10 0.80 .043 .031 a overall height 0.65 (bsc) .026 (bsc) p pitch 5 5 n number of pins max nom min max nom min dimension limits millimeters* inches units exceed .005" (0.127mm) per side. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not notes: jeita (eiaj) standard: sc-70 drawing no. c04-061 *controlling parameter l e1 e c d 1 b p a2 a1 a q1 top of molded pkg to lead shoulder q1 .004 .016 0.10 0.40 n
mcp6001/2/4 ds21733d-page 14 ? 2003 microchip technology inc. 5-lead plastic small outline transistor (ot) (sot23) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.50 0.43 0.35 .020 .017 .014 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 10 5 0 10 5 0 foot angle 0.55 0.45 0.35 .022 .018 .014 l foot length 3.10 2.95 2.80 .122 .116 .110 d overall length 1.75 1.63 1.50 .069 .064 .059 e1 molded package width 3.00 2.80 2.60 .118 .110 .102 e overall width 0.15 0.08 0.00 .006 .003 .000 a1 standoff 1.30 1.10 0.90 .051 .043 .035 a2 molded package thickness 1.45 1.18 0.90 .057 .046 .035 a overall height 1.90 .075 p1 outside lead pitch (basic) 0.95 .038 p pitch 5 5 n number of pins max nom min max nom min dimension limits millimeters inches* units 1 p d b n e e1 l c a2 a a1 p1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: mo-178 drawing no. c04-091 significant characteristic
? 2003 microchip technology inc. ds21733d-page 15 mcp6001/2/4 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic
mcp6001/2/4 ds21733d-page 16 ? 2003 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2003 microchip technology inc. ds21733d-page 17 mcp6001/2/4 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - -
mcp6001/2/4 ds21733d-page 18 ? 2003 microchip technology inc. 14-lead plastic dual in-line (p) ? 300 mil (pdip) e1 n d 1 2 eb e c a a1 b b1 l a2 p units inches* millimeters dimension limits min nom max min nom max number of pins n 14 14 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .740 .750 .760 18.80 19.05 19.30 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 5 10 15 5 10 15 5 10 15 5 10 15 mold draft angle bottom * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-001 drawing no. c04-005 significant characteristic
? 2003 microchip technology inc. ds21733d-page 19 mcp6001/2/4 14-lead plastic small outline (sl) ? narrow, 150 mil (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 8.81 8.69 8.56 .347 .342 .337 d overall length 3.99 3.90 3.81 .157 .154 .150 e1 molded package width 6.20 5.99 5.79 .244 .236 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d p n b e e1 h l c 45 a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-065 significant characteristic
mcp6001/2/4 ds21733d-page 20 ? 2003 microchip technology inc. 14-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 8 4 0 8 4 0 foot angle 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b1 lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 5.10 5.00 4.90 .201 .197 .193 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 14 14 n number of pins max nom min max nom min dimension limits millimeters* inches units l c 2 1 d n b p e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-087 significant characteristic
? 2003 microchip technology inc. ds21733d-page 21 mcp6001/2/4 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: mcp6001t: 1 mhz bandwidth, low power op amp (tape and reel) (sc-70, sot-23) mcp6001rt: 1 mhz bandwidth, low power op amp (tape and reel) (sot-23) mcp6001ut: 1 mhz bandwidth, low power op amp (tape and reel) (sot-23) mcp6002: 1 mhz bandwidth, low power op amp mcp6002t: 1 mhz bandwidth, low power op amp (tape and reel) (soic, msop) mcp6004: 1 mhz bandwidth, low power op amp mcp6004t: 1 mhz ,bandwidth low power op amp (tape and reel) (soic, msop) temperature range: i = -40c to +85c e = -40c to +125c package: lt = plastic package (sc-70), 5-lead (mcp6001 only) ot = plastic small outline transistor (sot-23), 5-lead (mcp6001, mcp6001r, mcp6001u) ms = plastic msop, 8-lead p = plastic dip (300 mil body), 8-lead, 14-lead sn = plastic soic, (150 mil body), 8-lead sl = plastic soic (150 mil body), 14-lead st = plastic tssop (4.4mm body), 14-lead part no. x /xx package temperature range device examples: a) mcp6001t-i/lt: tape and reel, industrial temperature, 5ld sc-70 package b) mcp6001t-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. c) mcp6001rt-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. d) mcp6001ut-e/ot:tape and reel, extended temperature, 5ld sot-23 package. e) mcp6001ut-i/ot: tape and reel, industrial temperature, 5ld sot-23 package. a) mcp6002-i/ms: industrial temperature, 8ld msop package. b) mcp6002-i/p: industrial temperature, 8ld pdip package. c) mcp6002-e/p: extended temperature, 8ld pdip package. d) mcp6002-i/sn: industrial temperature, 8ld soic package. e) mcp6002t-i/ms: tape and reel, industrial temperature, 8ld msop package. f) mcp6002t-i/sn: tape and reel, industrial temperature, 8ld soic package. a) mcp6004-i/p: industrial temperature, 14ld pdip package. b) mcp6004-i/sl: industrial temperature,, 14ld soic package. c) mcp6004-e/sl: extended temperature,, 14ld soic package. d) mcp6004-i/st: industrial temperature, 14ld tssop package. e) mcp6004t-i/sl: tape and reel, industrial temperature, 14ld soic package. f) mcp6004t-i/st: tape and reel, industrial temperature, 14ld tssop package. data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
mcp6001/2/4 ds21733d-page 22 ? 2003 microchip technology inc. notes:
? 2003 microchip technology inc. ds21733d-page 23 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, k ee l oq , mplab, pic, picmicro, picstart, pro mate and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, micro id , mxdev, mxlab, picmaster, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. accuron, application maestro, dspic, dspicdem, dspicdem.net, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, microport, migratable memory, mpasm, mplib, mplink, mpsim, picc, pickit, picdem, picdem.net, powercal, powerinfo, powermate, powertool, rflab, rfpic, select mode, smartsensor, smartshunt, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. serialized quick turn programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2003, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip's data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999 and mountain view, california in march 2002. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microperipherals, non-volatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001 certified.
ds21733d-page 24 2003 microchip technology inc. m americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com atlanta 3780 mansell road, suite 130 alpharetta, ga 30022 tel: 770-640-0034 fax: 770-640-0307 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 kokomo 2767 s. albright road kokomo, in 46902 tel: 765-864-8360 fax: 765-864-8387 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 phoenix 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7966 fax: 480-792-4338 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia microchip technology australia pty ltd marketing support division suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing microchip technology consulting (shanghai) co., ltd., beijing liaison office unit 915 bei hai wan tai bldg. no. 6 chaoyangmen beidajie beijing, 100027, no. china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu microchip technology consulting (shanghai) co., ltd., chengdu liaison office rm. 2401-2402, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-86766200 fax: 86-28-86766599 china - fuzhou microchip technology consulting (shanghai) co., ltd., fuzhou liaison office unit 28f, world trade plaza no. 71 wusi road fuzhou 350001, china tel: 86-591-7503506 fax: 86-591-7503521 china - hong kong sar microchip technology hongkong ltd. unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai microchip technology consulting (shanghai) co., ltd. room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen microchip technology consulting (shanghai) co., ltd., shenzhen liaison office rm. 1812, 18/f, building a, united plaza no. 5022 binhe road, futian district shenzhen 518033, china tel: 86-755-82901380 fax: 86-755-8295-1393 china - qingdao rm. b505a, fullhope plaza, no. 12 hong kong central rd. qingdao 266071, china tel: 86-532-5027355 fax: 86-532-5027205 india microchip technology inc. india liaison office marketing support division divyasree chambers 1 floor, wing a (a3/a4) no. 11, o?shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan microchip technology japan k.k. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5934 singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-6334-8870 fax: 65-6334-8850 taiwan microchip technology (barbados) inc., taiwan branch 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe austria microchip technology austria gmbh durisolstrasse 2 a-4600 wels austria tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark microchip technology nordic aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45-4420-9895 fax: 45-4420-9910 france microchip technology sarl parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany microchip technology gmbh steinheilstrasse 10 d-85737 ismaning, germany tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy microchip technology srl via quasimodo, 12 20025 legnano (mi) milan, italy tel: 39-0331-742611 fax: 39-0331-466781 united kingdom microchip ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44-118-921-5869 fax: 44-118-921-5820 05/30/03 w orldwide s ales and s ervice

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